A study article on the use of  digital twin in the packaging industry

Authors

  • Manisha Deshpande Mrs.
  • Sameer Deshpande Mr.

How to Cite

Deshpande, M., & Deshpande, S. (2024). A study article on the use of  digital twin in the packaging industry. International Journal of Engineering and Technology, 13(2), 326-329. https://doi.org/10.14419/x9g0ek58

Received date: April 14, 2024

Accepted date: April 28, 2024

Published date: September 18, 2024

DOI:

https://doi.org/10.14419/x9g0ek58

Keywords:

Applications; Digital Twin; Industry 4.0; Scope; Types.

Abstract

After the COVID pandemic, the packaging requirements have ever growing due to the safety and security of the inside product. The total market value of packaging materials at a global level was nearly 896 billion U.S. dollars in 2022. It is forecast that this global market value will increase upto approximately 1.15 trillion U.S. dollars by 2030.1 In Industry 4.0; the workforce, machines, and processes are linked through digital networks.2 Data and Digital twin control production processes have emerged as a powerful tool. The digital twin has multiple advantages in the packaging sector, from cost and time savings to sustainable packaging development.

 

References

  1. Madhumitha Jaganmohan, ‘Market value of packaging material worldwide from 2020 to 2022 with a forecast from 2023 to 2030, by region’ Published on statista.com November 2023 issue published on 10-01-2024. https://www.statista.com/statistics/1422303/global-packaging-material-market-val-ue/#:~:text=Global%20packaging%20material%20market%20value%202020%2D2030%2C%20by%20region&text=The%20total%20market%20value%20of,by%202030%20across%20all%20regions.
  2. Article, ‘Industry 4.0: Digitalization in the Printing & Packaging Industry’, published on Drupa website https://www.drupa.com/en/Home/Focus_subjects_%7C_drupa_2024/Industry_4.0_Digitalization_in_Print_Packaging_%7C_drupa
  3. Article published on the IBM website https://www.ibm.com/topics/what-is-a-digital-twin
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  5. An article ‘What is digital-twin technology?’, published in McKinsey Explainers on 12-07-2023 https://www.mckinsey.com/featured-insights/mckinsey-explainers/what-is-digital-twin-technology
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  7. Meaghan Ziemba, ‘4 Ways Digital Technologies Revolutionize Packaging Design and Processes’ Published in the Packaging Digest Magazine on 18-08-2023 https://www.packagingdigest.com/smart-manufacturing/4-ways-digital-technologies-revolutionize-packaging-design-and-processes
  8. Mark Juhasz, ‘The Digital Twin Emerges as Tool For Rapid FoodTech Product Iteration’, Published in The Spoon magazine on 07-02-2022 https://thespoon.tech/the-digital-twin-emerges-as-tool-for-rapid-foodtech-product-iteration/
  9. Rockwell Automation article, ‘Accelerate the deployment of innovation with digital twins’, Published in the Packaging Europe magazine published on 12-05-2023 https://packagingeurope.com/accelerate-the-deployment-of-innovation-with-digital-twins/9791.article
  10. Stephanie Neil, ‘Digital Twin Double-Take’ article published in OEM Magazine published on 17-12-2019 https://www.oemmagazine.org/engineering/machine-design/article/21104216/how-packaging-and-processing-machine-builders-are-using-digital-twin-technology
  11. Beth Stackpole, ‘Digital Twin Makes Virtual Commissioning a Reality’, article published in the Automation World Magazine on 22-01-2019 https://www.automationworld.com/products/software/article/13319468/digital-twin-makes-virtual-commissioning-a-reality
  12. Esko Studio, 3D Packaging Design Software https://www.esko.com/en/products/studio
  13. Digimarc product information, ‘Cloud Intelligence for Every Item’ https://www.digimarc.com/product-digitization/digital-twins
  14. Sarah Jones, ‘What is a digital twin? How intelligent data models can shape the built world’, an article published on Autodesk website on 30-06-2022 https://www.autodesk.com/design-make/articles/what-is-a-digital-twin

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How to Cite

Deshpande, M., & Deshpande, S. (2024). A study article on the use of  digital twin in the packaging industry. International Journal of Engineering and Technology, 13(2), 326-329. https://doi.org/10.14419/x9g0ek58

Received date: April 14, 2024

Accepted date: April 28, 2024

Published date: September 18, 2024